激光设备与系统
EM15单晶钻石 系统
Deliver deep cuts with low taper and superior surface quality for cutting natural and synthetic monocrystalline diamond and CVD wafers.
The use of a pulsed green laser in a proprietary method enables fast, precise cutting of diamond, eliminating the slow speed and damage risk of traditional sawing. Ideal for windows, heat sinks, precision tooling, acoustic wave applications, jewelry and more.
eM15– Cutting monocrystalline diamond and CVD wafers
Simplified control thanks to eMicro software. Choose only the level of automation and number of axes you need, including optional rotation axis for 4, 5 axis models.
产品规格
型号选项 |
激光详情 |
最大（XY）工作区域（毫米） |
安装区域（毫米） |
Typical Application |
部分装载 |
最大XY扫描速度（mm/min） |
3轴 |
15 W green (532 nm) DPSS laser |
200 × 200 |
150 x 150 |
2D (XY) cutting |
手动、自定义自动化 |
2000 |
4轴 |
D50 x 100 |
Shaped (3D) cutting |
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5轴 |
